QubitPack and the Packaging Beneath Quantum Hardware

Field notes

The homepage describes a three-part model: design, consulting, and a software platform still in development. Its stated workflow runs from wafer specification and packaging strategy through TSV architecture, design-for-test, PDK-aligned layouts, and documentation for handoff to a chosen foundry. The stated target is a 300mm quantum wafer platform, with applications listed across computing, sensing, and communications; no client work or completed designs are identified in the extract.