Observed arrival · 2026-10-25
Kerf & Korn follows silicon from cut to recovery
A German-language technical publication explains wafer sawing, silicon-carbide slurry, and material recovery in wafer manufacturing.
- For
- Wafer-fabrication students and process, procurement, and environmental staff
- Worth noticing
- Homepage figures include a patent-cited 85–95% reusable SiC-grain yield, alongside source links for each metric.
Field notes
Navigation divides the material into sawing and wafers, slurry processing, silicon carbide, and safety and environmental topics, with individual explainers and a glossary. The homepage says technical statements link to standards, publications, or patents; its metrics include a cited 200 μm kerf-loss figure for classic steel-wire slurry sawing and a patent-reported 85–95% reusable SiC-grain yield. These are presented with source references, not as results independently verified by the extract.
Observed signals
Read the marks
Editorial observations of this landing page, not a rating.
One card from the complete issue